– USA, NJ – Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, today announced the appointment of David B. Miller to the Rudolph Board of Directors, effective as of today.
Mr. Miller currently serves as the President of DuPont Electronics & Communications, a company with a $3 billion portfolio of diversified businesses in the electronics, photovoltaics (solar cells), displays, and printing industries, since November 2009. He previously served in a variety of roles within DuPont including Group Vice President and Chief Operating Officer of DuPont Electronic & Communication Technologies from June 2007 to October 2009, Vice President and General Manager of DuPont Electronic Technologies from February 2001 until May 2007, Director of DuPont Investor Relations from April 1999 to February 2001 and Managing Director, Asia Pacific of DuPont Photopolymer & Electronic Materials from March 1997 to March 1999. From 1981 to February of 1997, he served in various engineering, sales and management positions within the array of DuPont businesses. In addition to the foregoing, Mr. Miller currently is a member of the Semiconductor Equipment and Materials International (SEMI) board, a member of the NC Chamber of Commerce Board of Directors and a Trustee at the University of Virginia Engineering School.
“Dave brings a wealth of additional experience and knowledge to our board and we are excited to have him join us,” commented Paul F. McLaughlin, Chairman and CEO. “His breadth of industrial experience including that in the semiconductor equipment industry combined with his proficiency in domestic and international business affairs will provide Rudolph with valuable perspective as we continue to grow our company. We look forward to his insights, guidance and support.”
About Rudolph Technologies, Inc.
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and data analysis systems and software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. The Company’s expanding portfolio of equipment and software provides comprehensive solutions for front-end wafer processing, final manufacturing and advanced packaging of ICs. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization.
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