LEND.ch raises CHF6m series A financing led by Alpana Ventures

– SWITZERLAND, Zurich –  LEND – the swiss marketplace lending platform -, announced that it has successfully closed a CHF6m series A financing round led by Alpana Ventures and including angel investors.

Florian Kübler, CEO and co-founder of LEND: “Our successful track record remains convincing. In addition to existing investors, who have supported us since the beginning, we were able to attract new investors.”

LEND is a Swiss-based marketplace lending platform that empowers borrowers to obtain loans at better rates while enabling lenders to direct their own loan investment opportunities. With the newly raised funds, the fintech will further advance the digitization of its platform, professionalize new business areas and secure institutional credit facilities to finance loan projects.

Boosted by its strong track record in private and student loans, the startup now offers financing solutions for SMEs and transacts 2nd lien mortgages. The new business areas have taken off exceptionally well and LEND is driving the expansion through existing partnerships and direct channels. Meanwhile, control of creditworthiness remains a top priority for the company, which translates into an exceptionally low default rate (below 0.5%).

Already mainstream in the UK, marketplace lending has now arrived in Switzerland. LEND cooperates with several pension funds, family offices and banks, which are increasingly funding credit projects. Retail investors remain an important component however, and the fintech will continue to be open for them in the future.

For more, visit Lend.ch

- DisclaimerNews, data and statement included in this release are intended exclusively for general information purposes. Talent4Boards accepts neither liability for the consequences of the reader’s reliance, nor responsibility for the adequacy or accuracy of the information. No data or statement in this release should be considered for decisions about securities referred. Product and brand names used in this release maybe trademarks or registered trademarks of their respective owners.

Comments are closed.